Solder paste
Introduction:
This product is a no-clean solder paste in the production process. It uses imported organic active agents, high boiling point organic solvents, surfactants, natural organic acids, and polymer film-forming agents. It is formulated with adhesives, antioxidants, etc. It has excellent solderability, good wettability, moderate activity of flux, and spherical alloy powder with very low oxide content. Nitrogen protection is added under sealed vacuum conditions to ensure the production of the best quality solder paste.
Features of solder paste
:
: In high-speed continuous printing, consistent results can be obtained with good stability.
: Moderate viscosity, good thixotropy, not easy to collapse, no bridging, no false welding.
The residue after welding is very small, transparent, has a large insulation resistance, will not corrode the B board, and can meet the no-cleaning requirements.
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