Langfang Rongda Electronic Materials Co

Solder Paste
Introduction:
Type is a no-clean solder paste that uses imported organic active agents, high boiling point organic solvents, surfactants, natural organic acids, and high It is formulated with molecular film-forming agents, adhesives, antioxidants, etc. It has excellent solderability, good wettability, moderate activity of flux, and spherical tin-lead alloy powder with very low oxide content. Nitrogen protection is added under sealed vacuum conditions to ensure the production of the best quality solder paste< br/>.
Features of solder paste
:
: In high-speed continuous printing, consistent results can be obtained with good stability.
: Moderate viscosity, good thixotropy, not easy to collapse, no bridging, no false welding.
The residue after welding is very small, transparent, has a large insulation resistance, will not corrode the B board, and can meet the no-cleaning requirements.